4680-4105-job.gbrjob 3.5 KB

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  1. {
  2. "Header": {
  3. "GenerationSoftware": {
  4. "Vendor": "KiCad",
  5. "Application": "Pcbnew",
  6. "Version": "8.0.6"
  7. },
  8. "CreationDate": "2024-11-23T08:52:48+01:00"
  9. },
  10. "GeneralSpecs": {
  11. "ProjectId": {
  12. "Name": "4680-4105",
  13. "GUID": "34363830-2d34-4313-9035-2e6b69636164",
  14. "Revision": "Ver 1.00"
  15. },
  16. "Size": {
  17. "X": 160.2,
  18. "Y": 100.2
  19. },
  20. "LayerNumber": 4,
  21. "BoardThickness": 1.6,
  22. "Finish": "None"
  23. },
  24. "DesignRules": [
  25. {
  26. "Layers": "Outer",
  27. "PadToPad": 0.2,
  28. "PadToTrack": 0.2,
  29. "TrackToTrack": 0.2,
  30. "MinLineWidth": 0.2
  31. },
  32. {
  33. "Layers": "Inner",
  34. "PadToPad": 0.2,
  35. "PadToTrack": 0.2,
  36. "TrackToTrack": 0.2,
  37. "TrackToRegion": 0.5,
  38. "RegionToRegion": 0.5
  39. }
  40. ],
  41. "FilesAttributes": [
  42. {
  43. "Path": "4680-4105-F_Cu.gbr",
  44. "FileFunction": "Copper,L1,Top",
  45. "FilePolarity": "Positive"
  46. },
  47. {
  48. "Path": "4680-4105-In1_Cu.gbr",
  49. "FileFunction": "Copper,L2,Inr",
  50. "FilePolarity": "Positive"
  51. },
  52. {
  53. "Path": "4680-4105-In2_Cu.gbr",
  54. "FileFunction": "Copper,L3,Inr",
  55. "FilePolarity": "Positive"
  56. },
  57. {
  58. "Path": "4680-4105-B_Cu.gbr",
  59. "FileFunction": "Copper,L4,Bot",
  60. "FilePolarity": "Positive"
  61. },
  62. {
  63. "Path": "4680-4105-F_Paste.gbr",
  64. "FileFunction": "SolderPaste,Top",
  65. "FilePolarity": "Positive"
  66. },
  67. {
  68. "Path": "4680-4105-B_Paste.gbr",
  69. "FileFunction": "SolderPaste,Bot",
  70. "FilePolarity": "Positive"
  71. },
  72. {
  73. "Path": "4680-4105-F_Silkscreen.gbr",
  74. "FileFunction": "Legend,Top",
  75. "FilePolarity": "Positive"
  76. },
  77. {
  78. "Path": "4680-4105-B_Silkscreen.gbr",
  79. "FileFunction": "Legend,Bot",
  80. "FilePolarity": "Positive"
  81. },
  82. {
  83. "Path": "4680-4105-F_Mask.gbr",
  84. "FileFunction": "SolderMask,Top",
  85. "FilePolarity": "Negative"
  86. },
  87. {
  88. "Path": "4680-4105-B_Mask.gbr",
  89. "FileFunction": "SolderMask,Bot",
  90. "FilePolarity": "Negative"
  91. },
  92. {
  93. "Path": "4680-4105-Edge_Cuts.gbr",
  94. "FileFunction": "Profile",
  95. "FilePolarity": "Positive"
  96. }
  97. ],
  98. "MaterialStackup": [
  99. {
  100. "Type": "Legend",
  101. "Name": "Top Silk Screen"
  102. },
  103. {
  104. "Type": "SolderPaste",
  105. "Name": "Top Solder Paste"
  106. },
  107. {
  108. "Type": "SolderMask",
  109. "Thickness": 0.01,
  110. "Name": "Top Solder Mask"
  111. },
  112. {
  113. "Type": "Copper",
  114. "Thickness": 0.035,
  115. "Name": "F.Cu"
  116. },
  117. {
  118. "Type": "Dielectric",
  119. "Thickness": 0.1,
  120. "Material": "FR4",
  121. "Name": "F.Cu/In1.Cu",
  122. "Notes": "Type: dielectric layer 1 (from F.Cu to In1.Cu)"
  123. },
  124. {
  125. "Type": "Copper",
  126. "Thickness": 0.035,
  127. "Name": "In1.Cu"
  128. },
  129. {
  130. "Type": "Dielectric",
  131. "Thickness": 1.24,
  132. "Material": "FR4",
  133. "Name": "In1.Cu/In2.Cu",
  134. "Notes": "Type: dielectric layer 2 (from In1.Cu to In2.Cu)"
  135. },
  136. {
  137. "Type": "Copper",
  138. "Thickness": 0.035,
  139. "Name": "In2.Cu"
  140. },
  141. {
  142. "Type": "Dielectric",
  143. "Thickness": 0.1,
  144. "Material": "FR4",
  145. "Name": "In2.Cu/B.Cu",
  146. "Notes": "Type: dielectric layer 3 (from In2.Cu to B.Cu)"
  147. },
  148. {
  149. "Type": "Copper",
  150. "Thickness": 0.035,
  151. "Name": "B.Cu"
  152. },
  153. {
  154. "Type": "SolderMask",
  155. "Thickness": 0.01,
  156. "Name": "Bottom Solder Mask"
  157. },
  158. {
  159. "Type": "SolderPaste",
  160. "Name": "Bottom Solder Paste"
  161. },
  162. {
  163. "Type": "Legend",
  164. "Name": "Bottom Silk Screen"
  165. }
  166. ]
  167. }